Method for processing semiconductor wafer
US9881783B2 · kind B2 · utility
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4References
5Claims
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Key dates
| Filing date | Feb 4, 2014 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jan 2, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a wafer processing method by which, by using, as a reference surface, a flat surface obtained by applying a curable material to the whole of one surface of a wafer obtained by slicing a semiconductor single-crystal ingot by using a wire saw apparatus, surface grinding is performed on the other surface of the wafer and surface grinding is performed on the one surface of the wafer by using the other surface of the wafer subjected to surface grinding as a reference surface, both surfaces of the wafer are planarized at the same time immediately after the wafer is obtained by slicing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.