Substrate cleaning method, substrate cleaning device, and vacuum processing device
US9881815B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Jan 30, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate cleaning method for removing particles adhered to a substrate includes: acquiring particle information including diameters of the particles adhered to the substrate; controlling, based on the acquired particle information, a factor related to sizes of gas clusters having aggregates of atoms or molecules of a cleaning gas; ejecting the cleaning gas, at a higher pressure than a processing atmosphere where the substrate is provided, to the processing atmosphere and generating the gas clusters by adiabatic expansion; and removing the particles by irradiating the gas clusters in a perpendicular direction to a surface of the substrate. As a result, even if recesses for a circuit pattern are formed on the surface of the substrate, the particles in the recesses can be removed at a high removal rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.