Patent · US Active

MEMS sensor package systems and methods

US9884757B2 · kind B2 · utility

10Cited by

4References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernhard Winkler · Birkenfeld, DE
Rainer Leuschner · Regensburg, DE
Horst Theuss · Wenzenbach, DE

Key dates

Filing date	Dec 20, 2013
Grant date	Feb 6, 2018
Priority date	—
Expiry date	Mar 7, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.