Apparatus for treating surfaces of wafer-shaped articles
US9887120B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Nov 3, 2015 |
| Grant date | Feb 6, 2018 |
| Priority date | — |
| Expiry date | Feb 18, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/1926
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A rotary chuck for processing wafer-shaped articles comprises a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to the chuck body from a first position in which the gripping pins are relatively more retracted into the chuck body to a second position in which the gripping pins are relatively more extended from the chuck body and in which the gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.