Substrate processing apparatus and substrate processing method
US9889476B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first holding plate and a second holding plate are provided. The first holding plate has a first flat plate portion facing a bottom surface of a substrate and holds the substrate so as to form a gap between the first flat plate portion and the substrate as a first gap, and the second holding plate has a second flat plate portion facing the bottom surface of the substrate and holds the substrate so as to form a gap between the second flat plate portion and the substrate as a second gap. Depending on a processing to be performed, any one of the first holding plate and the second holding plate is mounted on a rotational shaft of a shaft mechanism that includes a fluid supply unit configured to supply a fluid to the bottom surface of the substrate and the rotational shaft configured to rotate the substrate. The processing is performed on the substrate by supplying the fluid to the bottom surface of the substrate from the fluid supply unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.