Method of controlling adherence of microparticles to substrate to be processed, and processing apparatus
US9892951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2012 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Mar 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of controlling adherence of microparticles to a substrate to be processed includes applying voltage to an electrostatic chuck configured to electrostatically attract the substrate to be processed in a processing container before the substrate to be processed is carried into the processing container; and, after the applying of voltage to the electrostatic chuck, carrying the substrate to be processed into the processing container. Further, in the applying of voltage to the electrostatic chuck, the voltage is applied to the electrostatic chuck to reduce a potential difference between a focus ring and the substrate to be processed, the focus ring being provided to surround the electrostatic chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.