Producing wafer level packaging using leadframe strip and related device
US9892999B2 · kind B2 · utility
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1References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 7, 2016 |
| Grant date | Feb 13, 2018 |
| Priority date | — |
| Expiry date | Jun 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.