Selective deposition of metals, metal oxides, and dielectrics
US9895715B2 · kind B2 · utility
495Cited by
50References
27Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 3, 2015 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Feb 3, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1245
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods are provided for selectively depositing a material on a first surface of a substrate relative to a second, different surface of the substrate. The selectively deposited material can be, for example, a metal, metal oxide, or dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.