Device and method for substrate heating during transport

US9899242B2 · kind B2 · utility

Assignee

• Varian Semiconductor Equipment Associates, Inc. · US

Inventors

• Jason M. Schaller · Austin, US
• Morgan Evans · Attleboro, US
• Ala Moradian · Sunnyvale, US
• Robert Brent Vopat · Austin, US
• David Blahnik · Round Rock, US
• William T. Weaver · Austin, US

Key dates

• Filing date: Apr 6, 2015
• Grant date: Feb 20, 2018
• Expiry date: Mar 12, 2036

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F27D2003/0051
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.