Patent · US Active

Integrated circuit substrate and method for manufacturing the same

US9899277B2 · kind B2 · utility

0Cited by

0References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Claudia Sgiarovello · Villach, AT
Martin Mischitz · Wernberg, AT
Andrew Christopher Graeme Wood · St. Jakob im Rosental, AT

Key dates

Filing date	Feb 19, 2016
Grant date	Feb 20, 2018
Priority date	—
Expiry date	Feb 19, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a wafer. The method includes providing a wafer and testing the wafer. Based on a test result, a substance is selectively provided on the wafer to obtain an altered wafer that has at least one selected portion altered. The method includes forming a structural layer over the altered wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.