Electronic package and semiconductor substrate
US9899309B2 · kind B2 · utility
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 30, 2016 |
| Grant date | Feb 20, 2018 |
| Priority date | — |
| Expiry date | Mar 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.