Polishing apparatus, polishing method, and semiconductor manufacturing method
US9902038B2 · kind B2 · utility
3Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Nov 20, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus includes a polisher, a holder, and a supplier. The polisher polishes a semiconductor substrate or a polishing target film on a semiconductor substrate. The holder holds the semiconductor substrate and presses the semiconductor substrate or the polishing target film against the polisher to rub the semiconductor substrate or the polishing target film against the polisher. The supplier has a nozzle that is to be inserted to the inside of the polisher and that supplies a polishing solution to the inside of the polisher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.