Sensor package structure
US9905597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2017 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to a peripheral portion of the covering portion. The supporting portion having a coefficient of thermal expansion less than 10 ppm/° C. is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone. The encapsulating compound is disposed on the wiring zone and covers a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.