Method for manufacturing a printed circuit board with high-capacity copper circuit
US9907167B1 · kind B1 · utility
0Cited by
2References
10Claims
0Family size
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Inventors
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | Feb 27, 2018 |
| Priority date | — |
| Expiry date | Dec 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board with high-capacity copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer formed on opposite sides of the conductive trace. The conductive trace includes a base conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the base copper conductive trace pattern. A trace width of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.