Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
US9909213B2 · kind B2 · utility
2Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Jul 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32834
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment of the present invention provides a flow equalizer assembly for disposing between a vacuum port and a processing volume in a processing chamber. The flow equalizing assembly includes a first plate having at least one first opening, and a second plate having two or more second openings. The first and second plates define a flow redistributing volume therebetween, and the at least one first opening and the two or more second openings are staggered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.