Patent · US Active

Method, apparatus and system for single-ended communication of transaction layer packets

US9910814B2 · kind B2 · utility

0Cited by

3References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bryan L. Spry · Portland, US
Su Wei Lim · Klang, MY
Mikal C. Hunsaker · Cameron Park, US
Rohit Verma · Fremont, US
Lily P. Looi · Portland, US
Ronald W. Swartz · Loomis, US
Michael W. Leddige · Beaverton, US
Vui Yong Liew · Bukit Mertajam, MY

Key dates

Filing date	Mar 13, 2015
Grant date	Mar 6, 2018
Priority date	—
Expiry date	Sep 17, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.