Glass interposer with embedded thermoelectric devices
US9913405B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2015 |
| Grant date | Mar 6, 2018 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.