Method of forming a structure on a substrate
US9916980B1 · kind B1 · utility
456Cited by
724References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2016 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Dec 15, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45525
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a layer on a substrate is provided by providing the substrate with a hardmask material. The hardmask material is infiltrated with infiltration material during N infiltration cycles by:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.