Patent · US Active

Method of forming a structure on a substrate

US9916980B1 · kind B1 · utility

456Cited by
724References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 15, 2016
Grant dateMar 13, 2018
Priority date
Expiry dateDec 15, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/45525
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method of forming a layer on a substrate is provided by providing the substrate with a hardmask material. The hardmask material is infiltrated with infiltration material during N infiltration cycles by:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.