Substrate support assembly having a plasma resistant protective layer
US9916998B2 · kind B2 · utility
2Cited by
52References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 21, 2013 |
| Grant date | Mar 13, 2018 |
| Priority date | — |
| Expiry date | Jan 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24997
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.