Production-level modularized load board produced using a general universal device interface for automatic test equipment for semiconductor testing
US9921244B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2017 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Jan 24, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present utilize a specialized modular load board in combination with previously-tested daughter boards to yield a final design for generating a new printed circuit board (PCB) for testing. Since the electrical characteristics of the daughter board are already known by the client and well established during previous testing procedures, similar test programs can be used for production-level testing that were used in client prototyping processes that involved the use of the previously-tested daughter board. Thus, embodiments of the present disclosure can use the features of the specialized modular load board and a client's tested daughter board to develop more reliable, production-ready circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.