Daniel Lam
10Patents
2h-index
11Co-inventors
47Inventor score
Filing activity: Dec 27, 2002 → Jul 31, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10114067B2 | Integrated waveguide structure and socket structure for millimeter waveband testing | Physics | 16 | Active |
| US7053640B2 | System and method for providing high RF signal isolation and low common ground inductance in an RF circuit testing environment | Physics | 7 | Expired |
| US10371716B2 | Method and apparatus for socket power calibration with flexible printed circuit board | Physics | 2 | Active |
| US9838076B2 | Handler with integrated receiver and signal path interface to tester | Physics | 2 | Active |
| US10381707B2 | Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing | Electricity | 1 | Active |
| US10520360B1 | Automated power-in-the-bucket measurement apparatus for large aperture laser systems | Physics | 0 | Active |
| US9921244B1 | Production-level modularized load board produced using a general universal device interface for automatic test equipment for semiconductor testing | Physics | 0 | Active |
| US10944148B2 | Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing | Electricity | 0 | Active |
| US10393772B2 | Wave interface assembly for automatic test equipment for semiconductor testing | Electricity | 0 | Active |
| US9921266B1 | General universal device interface for automatic test equipment for semiconductor testing | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.