Interconnect structure for package-on-package devices and a method of fabricating
US9922903B2 · kind B2 · utility
11Cited by
32References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Mar 20, 2018 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.