Inspection method and apparatus, and lithographic apparatus
US9927717B2 · kind B2 · utility
1Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2014 |
| Grant date | Mar 27, 2018 |
| Priority date | — |
| Expiry date | Nov 7, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of correcting an image characteristic of a substrate onto which one or more product features have been formed using a lithographic process, and an associated inspection apparatus method. The method includes measuring an error in the image characteristic of the substrate, and determining a correction for a subsequent formation of the product features based upon the measured error and a characteristic of one or more of the product feature(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.