Patent · US Active

Method of producing a removable wafer connection and carrier for wafer support

US9929035B2 · kind B2 · utility

1Cited by

1References

4Claims

0Family size

Assignee

AMS AG · AT

Inventors

Thomas Bodner · Seiersberg, AT
Joerg Siegert · Graz, AT
Martin Schrems · Langenbruck, DE

Key dates

Filing date	Dec 19, 2013
Grant date	Mar 27, 2018
Priority date	—
Expiry date	Oct 1, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1111
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the center of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.