Wafer edge trimming tool using abrasive tape
US9931726B2 · kind B2 · utility
1Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Aug 27, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.