Method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure

US9932223B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hans Artmann · Magstadt, DE
• Arnd Kaelberer · Neckargemünd, DE
• Christian Zielke · Eningen unter Achalm, DE
• Oliver Breitschaedel · Gomaringen, DE
• Peter Borwin Staffeld · Stuttgart, DE

Key dates

• Filing date: Apr 13, 2016
• Grant date: Apr 3, 2018
• Expiry date: Apr 13, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/014
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure. The method includes provision of a carrier substrate including a first surface, an application of an insulation layer onto the first surface, an epitaxial growth of a first silicon layer onto the insulation layer, a structuring of the first silicon layer for forming trenches in the first silicon layer, a passivation of the first silicon layer, whereby the trenches are filled and a passivation layer is formed on a side facing away from the first surface, a structuring of the passivation layer, sacrificial areas and functional areas being formed in the first silicon layer, and the sacrificial areas are free of the passivation layer, at least at some points, on a side facing away from the carrier substrate, and, finally, removal of the sacrificial areas.