Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US9932684B2 · kind B2 · utility
1Cited by
16References
8Claims
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Key dates
| Filing date | Jul 27, 2016 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09209
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of α-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.