Semiconductor device packages and methods
US9935038B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2012 |
| Grant date | Apr 3, 2018 |
| Priority date | — |
| Expiry date | Apr 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.