Methods of wafer processing with carrier extension
US9938621B2 · kind B2 · utility
1Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | May 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods are provided for treating wafers using a wafer carrier rotated about an axis. The wafer carrier is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.