Conductive structures, systems and devices including conductive structures and related methods
US9941209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Apr 10, 2018 |
| Priority date | — |
| Expiry date | Mar 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/35
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Conductive structures include stair step structures positioned along a length of the conductive structure and at least one landing comprising at least one via extending through the conductive structure. The at least one landing is positioned between a first stair step structure of the stair step structures and a second stair step structure of the stair step structures. Devices may include such conductive structures. Systems may include a semiconductor device and stair step structures separated by at least one landing having at least one via formed in the at least one landing. Methods of forming conductive structures include forming at least one via through a landing positioned between stair step structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.