Patent · US Active

Device including semiconductor chips and method for producing such device

US9941229B2 · kind B2 · utility

2Cited by

4References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Petteri Palm · Regensburg, DE
Thorsten Scharf · Regensburg, DE

Key dates

Filing date	Oct 31, 2013
Grant date	Apr 10, 2018
Priority date	—
Expiry date	Nov 30, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0152
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.