Thermal management of edge ring in semiconductor processing
US9947559B2 · kind B2 · utility
2Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2012 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Feb 4, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4585
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for processing semiconductors are provided herein. In some embodiments, an apparatus for processing a substrate may include: a first ring disposed concentrically about a substrate support, the first ring configured to position a substrate atop the substrate support during processing; and a second ring disposed between the substrate support and the first ring, the second ring configured to provide a heat transfer path from the first ring to the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.