Device and method for permanent bonding
US9947638B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2015 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Apr 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20108
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and corresponding device for permanent bonding of a first layer of a first substrate to a second layer of a second substrate on a bond interface, characterized in that a dislocation density of a dislocation of the first and/or second layer is increased at least in the region of the bond interface before and/or during the bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.