Semiconductor device and method for manufacturing same
US9947681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2016 |
| Grant date | Apr 17, 2018 |
| Priority date | — |
| Expiry date | Sep 7, 2036 |
Classification
- Technology area (CPC —)General
Abstract
According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method includes forming a stacked body alternately stacked with a plurality of members and a plurality of intermediate bodies having materials different from materials of the plurality of members, processing an end portion of at least two layers of the plurality of members sequentially in a stacking direction of the stacked body, and forming a step-wise step stacked with the plurality of members and the plurality of intermediate bodies, forming a plurality of side wall films contacting the step and making the end portion of the plurality of members in a step-wise. The making the end portion of the plurality of members in a step-wise includes retreating a portion of the plurality of members, the portion separated from the plurality of side wall films and exposed from the stacked body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.