Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process
US9952041B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
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Key dates
| Filing date | Jan 23, 2014 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Aug 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.