Warpage controlled package and method for same
US9953934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2015 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | Dec 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A warp controlled package includes a substrate that assumes a warped configuration according to the application of heat. At least one device is coupled along the substrate. A plurality of electrical contacts extend between at least the device and the substrate. One or more counter moment elements are coupled with the substrate. The one or more counter moment elements include a passive configuration and a counter moment configuration. In the counter moment configuration the one or more counter moment elements are configured to apply a counter moment to the substrate to counteract the warped configuration. In the passive configuration the one or more counter moment elements are configured to apply a neutral counter moment less than the counter moment of the counter moment configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.