Method of metrology, inspection apparatus, lithographic system and device manufacturing method
US9958789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Jun 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a method of determining a correction for measured values of radiation diffracted from a target comprising a plurality of periodic structures, subsequent to measurement of the target using measurement radiation defining a measurement field. The correction acts to correct for measurement field location dependence in the measured values. The method comprises performing a first and second measurements of the periodic structures; and determining a correction from said first measurement and said second measurement. The first measurement is performed with said target being in a normal measurement location with respect to the measurement field. The second measurement is performed with the periodic structure in a shifted location with respect to the measurement field, said shifted location comprising the location of another of said periodic structures when said target is in said normal measurement location with respect to the measurement field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.