Life enhancement of ring assembly in semiconductor manufacturing chambers
US9960019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2014 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Aug 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.