Processes to pattern small features for advanced patterning needs
US9960038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2011 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods of forming microelectronic structure are provided. The methods comprise the formation of T-shaped structures using a controlled undercutting process, and the deposition of a selectively etchable composition into the undercut areas of the T-shaped structures. The T-shaped structures are subsequently removed to yield extremely small undercut-formed features that conform to the width and optionally the height of the undercut areas of the T-shaped structures. These methods can be combined with other conventional patterning methods to create structures having extremely small feature sizes regardless of the wavelength of light used for patterning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.