Metalized molded plastic components for millimeter wave electronics and method for manufacture
US9960468B2 · kind B2 · utility
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21References
15Claims
0Family size
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Key dates
| Filing date | Sep 7, 2012 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Jun 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Waveguide components that have a high degree of performance accuracy over the temperature range of interest are provided. The components require no post-formation trimming steps, are light-weight, and dimensionally stable. In addition, a method for the manufacture of these millimeter wave components is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.