Wafer arrangement and method for processing a wafer
US9966293B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2014 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Dec 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.