Stretchable semiconductor packages and semiconductor devices including the same
US9972568B2 · kind B2 · utility
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3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2017 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Sep 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.