Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor

US9972609B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Min Tao · San Jose, US
• Hoki Kim · Hopewell Junction, US
• Ashok S. Prabhu · San Jose, US
• Zhuowen Sun · Campbell, US
• Wael Zohni · San Jose, US
• Belgacem Haba · Cupertino, US

Key dates

• Filing date: Dec 28, 2016
• Grant date: May 15, 2018
• Expiry date: Dec 28, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Package-on-package (“PoP”) devices with WLP (“WLP”) components with dual RDLs (“RDLs”) for surface mount dies and methods therefor. In a PoP, a first IC die surface mount coupled to an upper surface of a package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region. A molding layer is formed over the upper surface of the package substrate. A first and a second WLP microelectronic component are located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. Each of the first and the second WLP microelectronic components have a second IC die located between a first RDL and a second RDL. A third and a fourth IC die are respectively surface mount coupled over the first and the second WLP microelectronic components.