Etching for probe wire tips for microelectronic device test
US9977054B2 · kind B2 · utility
1Cited by
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21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Mar 18, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06755
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Etching for probe wire tip is described particularly well suited to microelectronic device test. In one example, wires of a probe head are covered with an encapsulation material, the wires being attached to a test probe head substrate, each of the wires having two ends, the first end being attached to the substrate and the second end being opposite the substrate, each wire having an outer coating around a core. The wires are etched to remove the outer coating at the second end of the wires. The encapsulation material is then removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.