Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions
US9984894B2 · kind B2 · utility
2Cited by
134References
16Claims
0Family size
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Key dates
| Filing date | Aug 3, 2011 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Oct 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming a semiconductor structure include providing an insulation layer on a semiconductor layer and diffusing cesium ions into the insulation layer from a cesium ion source outside the insulation layer. A MOSFET including an insulation layer treated with cesium ions may exhibit increased inversion layer mobility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.