Package-on-package structure and methods for forming the same
US9985013B2 · kind B2 · utility
0Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes coining solder balls of a bottom package, wherein top surfaces of the solder balls are flattened after the step of coining. The solder balls are molded in a molding material. The top surfaces of the solder balls are through trenches in the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.