Method and apparatus for testing interposer dies prior to assembly
US9989572B1 · kind B1 · utility
1Cited by
2References
16Claims
0Family size
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Key dates
| Filing date | Sep 23, 2014 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Aug 26, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318513
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and a probe device for testing an interposer prior to assembly are described herein. The method includes coupling a plurality of probe tips of a probe device to the plurality of signal interconnect paths of the interposer to be tested. A test signal is provided from the probe device to the plurality of signal interconnect paths of the interposer and a quality characteristic of signal interconnect paths of the interposer is detected based on behavior of the interposer in response to the test signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.