Apparatus for etching high aspect ratio features
US9991109B2 · kind B2 · utility
2Cited by
23References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2013 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Feb 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.