Patent · US Active

Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component

US9991177B2 · kind B2 · utility

0Cited by

4References

3Claims

0Family size

Assignee

AMS AG · AT

Inventors

Helene Gehles · Ergolding, DE
Thomas Bodner · Seiersberg, AT
Joerg Siegert · Graz, AT

Key dates

Filing date	Nov 29, 2017
Grant date	Jun 5, 2018
Priority date	—
Expiry date	Nov 29, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76898
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.