Semiconductor package having an EMI shielding layer
US9991211B2 · kind B2 · utility
2Cited by
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14Claims
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Key dates
| Filing date | May 26, 2017 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.